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Description
This study investigates the microstructural evolution and interlayer bonding behavior of bi-metallic interfaces fabricated through wire arc additive manufacturing (WAAM), focusing on ER70S-6 and ER308L materials. Employing scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS/EDAX), the research explores the impact of cold deformation on surface morphology, grain size distribution, and the development of microstructural features such as dislocations and twins. These advanced microscopy and spectroscopy techniques are essential for providing detailed insights into the complex interfacial bonding mechanisms and structural changes occurring at the bi-metallic interface. Additionally, elemental composition analysis provided by EDS enables the identification of intermetallic compounds and phase boundaries, further elucidating the bonding behavior. The study addresses the crucial need for understanding and optimizing the WAAM process, as well as selecting suitable materials to achieve robust interlayer bonding, which is essential for ensuring component quality and integrity. Furthermore, the investigation highlights the beneficial effects of bi-metallic structures, including enhanced mechanical properties, improved corrosion resistance, and increased design flexibility. By uncovering fundamental mechanisms governing bi-metallic bonding under cold deformation, this research contributes to advancing additive manufacturing technologies and enhancing the performance and reliability of manufactured components across diverse industrial sectors.
