Speakers
Description
The reliability of electronic packaging is a critical factor that determines the performance and lifespan of modern electronic devices. This paper investigates the mechanical and thermal performance of solder joints using SAC305, SAC387, and SAC405 alloy compositions, as well as variations in solder joint structural parameters. Finite Element Analysis (FEA) was conducted using ANSYS software to model and simulate the behavior of solder joints and evaluates their responses to thermal cycling and mechanical stress. Key performance metrics - such as stress distribution, deformation, and solder fatigue are analyzed to assess their reliability under consumer electronics operating conditions. The results demonstrated that solder joint height significantly influences thermomechanical performance. Among the tested heights, the 0.24 mm configuration consistently exhibited favourable behaviour, achieving a balanced distribution of stress and plastic strain while minimizing excessive deformation. Conversely, heights of 0.20 mm and 0.22 mm were prone to higher localized strain accumulation, whereas 0.26 mm, despite offering reduced strain, showed increased total deformation which may promote long-term fatigue. In terms of material selection, SAC405 emerged as the most reliable solder alloy, exhibiting the lowest equivalent plastic strain and strain energy density under identical loading conditions. This superior performance is attributed to its enhanced thermal fatigue resistance and minimal creep deformation. SAC305 and SAC387 followed behind, with SAC387 demonstrating higher stiffness but being more susceptible to creep, particularly under extended thermal cycling. SAC305 offered balanced properties but showed relatively higher plastic deformation and energy dissipation. This study offers practical guidance for material selection and solder joint design, contributing to the development of more robust and reliable electronic devices, addressing critical challenges in the rapidly evolving field of electronic packaging.
