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Description
This paper presents the design, simulation, and analysis of a MEMS-based thermal sensor using MEMSPro and ANSYS software, with the objective of evaluating the impact of key design parameters on sensor performance. The sensor was fabricated virtually using MEMSPro, following standard microfabrication processes including photolithography, deposition, and etching. Finite element analysis was conducted in ANSYS to assess the sensor’s thermal response under varying conditions. Four primary parameters were investigated: coil material (brass, gold, copper), coil thickness (1 µm, 3 µm, 6 µm), parylene type (Parylene-C, -F, -N), and input temperature (ranging from 10 °C to 90 °C). The results demonstrate that these parameters significantly influence the average temperature and electrical resistance across the sensor. It was found that brass exhibited the highest average temperature, while Parylene-N, with the highest thermal conductivity, produced the greatest thermal response. These findings provide insights into optimizing MEMS thermal sensor designs for enhanced sensitivity and stability, with potential applicability in real-time temperature monitoring systems.
