BOND21 (https://bond21.unimap.edu.my/) is a Joint International Conference on Nanoscience and Nanoengineering hosted by the Institute of Nano Electronic Engineering (INEE), Universiti Malaysia Perlis (UniMAP). The conference will be held at Bangi Resort Hotel, Bangi, Selangor, Malaysia, on 30th September to 1st October 2026.
BOND21 believes on the principle of building the nation’s wealth and prosperity through the advancement in science and technology. Therefore, the theme for 2026’s conference is chosen as “Nanoscience and Nanoengineering for Nation’s Growth and Sustainability.”
IMPORTANT NOTES TO AUTHORS:
- First, authors need to submit an abstract, please click the "Submit Now" button at the bottom of this page to proceed with the submission.
- Once the abstract was submitted, authors can proceed with the registration as a confirmation of interest to submit to ICoFCHeM 2026.
- For authors whose abstract has been accepted, please proceed with the submission of your full paper through the FrappeHub Portal by clicking on the tab "My Conference" > "My Contributions", then click on your abstract title. Then, click on the "Submit paper" button. Next, you can upload your full paper.
- Once your full paper has been accepted, you can proceed with the registration and payment process.
