Speaker
Description
Permeable pavement is a green infrastructure where it is a stormwater control. It has joints filled with a porous substance that allows water to travel through which can prevent floods. Disposing of semiconductor epoxy mold component resin waste (SEMC-RW) is a major concern due to their recalcitrant nature with only 18% currently being recycled and around 12,000 Mt of plastic waste is ending up in landfills and the environment. The main objective in this study is to determine the optimum composition of Semiconductor Epoxy Mold Component Resin Waste (SEMC-RW) reinforced Recycled-High Density Polyethylene (R-HDPE) to produce a SEMC-RW/R-HDPE composite permeable pavement. The fabrication stage involved the cleaning and crushing of R-HDPE at Angkasa Kowaris Plastics Sdn. Bhd. and the grinding process of SEMC-RW provided by ST Microelectronics Sdn. Bhd. with particle size of 1.0 ± 0.05 mm to produce SEMC-RW/R-HDPE composite permeable pavement with different ratios, 10% to 80% (wt/wt%) SEMC-RW reinforced with 50% (wt/wt%) R-HDPE. The composite was heated at 160°C in a furnace for 3 hours. The results show the ratio of 50% - 50 % (wt/wt%) of SEMC-RW/R-HDPE composite permeable pavement gives higher tensile strength (ASTM-D3039) at 2.67 MPa and bending strength (ASTM D425) at 2.05 MPa. It is also producing a strong matrix reinforcement bonding through Scanning Electron Microscope (SEM) analysis (ASTM E766-14) and rate of fire resistance (ASTM E-119) at 83%. In conclusion, the 50% SEMC-RW/R-HDPE composite permeable pavement has potential to be apply on permeable pavement application.
